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January 21, 2021

[Text|High-tech LED reporter Gan Qin] On September 26-28, 2014, Gaogong LED Lighting Exhibition (fourth) opened in Guangzhou Pazhou Canton Fair, Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as "Morning Technology") brought a series of COB packaging silicone, COB dam glue and other LED packaging technology debut.

Morning Technology is committed to the development and production of electronic and chemical products such as cost-effective and environmentally-friendly solders. It has an integrated soldering solution from semiconductors to components to electronics assembly, and has been recognized by many well-known devices and electronics manufacturers.

Zhang Xueqing, director of morning technology sales, said that COB packaging has become a trend. The company takes the current mainstream COB packaging process and flip chip packaging process as the entry point, through three core materials (solid crystal solder paste, dam glue, jelly glue) -- One-component silica gel and phosphor blending to create the most simplified LED luminaire manufacturing solution.

Zhang Xueqing pointed to the LED filament lamp bracket on the stand. "The majority of the LED filament lamp brackets in the industry use a formal dressing process, and our product uses a flip-chip process, which is rare in the industry."

Zhang Xueqing said, "The COB dam rubber WB-20/WB-30 series of dams such as the morning technology has high brightness, good adhesion, no collapse, no cracking, and can be baked at 280 °C without deformation or change. yellow".

Zhang Xueqing pointed out that after the launch of COB silica gel and COB dam rubber, the company has achieved good market response and has been recognized by the majority of packaging customers. In the second half of last year, the company's COB silica gel and COB dam rubber achieved a surge in sales. .

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